AURORA, IL…Floor warming technology is stepping into the future with a new breakthrough innovation—TEC™ In-Floor Heat. Unlike other floor warming systems available, TEC™ In-Floor Heat is customizable on-site to fit any space, with no down time for special ordering. TEC™ In-Floor Heat features no embedded heating wires that need to be patterned, and is thinner than other alternatives on the market at just 1/64” thin.

AURORA, IL… H.B. Fuller Construction Products announces the latest innovation in moisture mitigation with the introduction of a new moisture vapor barrier: TEC^® LiquiDam EZ™. The product, which is available for distribution throughout U.S. and Canada, is the first of its kind, building upon the company’s current moisture mitigation flagship product, TEC^® LiquiDam™.

AURORA, IL…TEC^® introduces Preformed Components to its line of flooring and tile installation products. The new additions to the full TEC^® system include preformed niches, slopes, curbs and shower seats, which allow contractors to create beautiful spa-like spaces without sacrificing profitability and efficiency.

AURORA, IL…TEC® will present a new webinar on exterior tile installations at 1 p.m. CST/ 2 p.m. EST on July 22, 2015. This webinar, titled “Strategies for Exterior Tile Installations”, explores products and strategies that will guide professional contractors toward successful installations in difficult outdoor environments.

TEC®, a proud member and supporter of NTCA, presents this webinar with the help of Tom Plaskota, TEC® Technical Support Manager.

AURORA, IL…TEC® products were used in two winning projects in the 15^th Annual Starnet Design Awards, held April 17 in Tucson, AZ.

The awards were held as part of the Starnet Worldwide Commercial Flooring Partnership’s Annual Meeting. These awards highlight cooperation between Starnet members and the architecture and design community, and recognize inventive uses of flooring in commercial design. Winning projects were selected by a panel of architecture and design professionals.